Products
Standard Specification
| Unit | Single layer (Single-sided) |
Two layers (Double-sided) |
Multi-layers (Up to 6layers) |
||
|---|---|---|---|---|---|
| Minimum total thickness (reference value) |
µm | 70 | 100 | 250 | |
| Min.line Line/Space L/S |
Surface | µm | 60/60 | 75/75 | 100/100 |
| Inner | µm | — | — | 75/75 | |
| Inter-layer connection | — | Pierced through hole (TH), inner via hole (IVH) | |||
| Hole diameter (finished) /Land diameter |
mm | 200/500 | |||
| Cover layer | — | Polyimide(CL), Solder resist(SR) | |||
| Surface finish | — | Ni-Au plating, Solder plating (Lead-free solder can be used solder leveler, chemical treatment) |
|||
Standard Lead-time
| Proto-type | Mass-production | |
|---|---|---|
| Single-sided | 3days | 10days |
| Double-sided | 4days | 15days |
| Multi-layers | 7days | 30days |
