FPC : Flexible Printed Circuits
Environment-Proof FPC
Flexible Printed Circuit Boards for Use in High Temperature, High-Pressure Steam Environments
Overview
A lineup of two new types of heat-proof and high-pressure steam-proof FPC products facilitate use under high-temperature and high-pressure steam environments.
Features
- Heat-proof FPC
The heat-proof FPC maintains insulation layer adhesion and insulation resistance even after high-temperature processes at 200 ℃for 1,000 hours. - High-pressure steam-proof FPC
The high-pressure steam-proof FPC maintains insulation layer adhesion and insulation resistance even after high-temperature steam treatments at 132 ℃and 0.2 Mpa for 15 minutes over 250 cycles.
Use Cases
These features of the FPCs enable wiring for applications that include semiconductor manufacturing equipment involving high-temperature heat treatments and medical equipment requiring high-pressure steam sterilization.
Product Specifications
| Item | Specifications |
|---|---|
| Structure (Layers) | Single-sided (one layer) |
| Maximum wiring length | 450 mm |
Characteristic Example
| Product | Item | Properties | Conditions |
|---|---|---|---|
| Heat-proof FPC | Solder resist coating adhesion | No peeling | 1,000 hours at 200 ℃ |
| Withstanding voltage | No flashover or other faults | ||
| Insulation resistance | 1.0 × 10⁷ MΩ | ||
| High-pressure Steam-proof FPC | Solder resist coating adhesion | No peeling | 132 ℃ / 0.2 MPa / 15 mins × 250 cycles |
| Withstanding voltage | No flashover or other faults | ||
| Insulation resistance | 1.1 × 10⁶ MΩ |
